Manufacturing Capability

Manufacturing process of PCB boards produced at ShingTech Electronics as well as the detailed introduction.
It is mainly divided into double-layer board process and multi-layers PCB process.
ShingTech Electronics holds the most serious attitude to manufacture the most precise printed circuit boards.
The following is the detailed manufacturing procedures for your information.

Double-layer Board Process

Multilayer Board Process

FLOW

Double-layer Board Process

CAM

Art Work

Issue Material

Drilling

Plating

Outer Layer

AOI-Outer

Solder Mask

Exposure/Silk screen

Surface Treatment

O/S Test

CNC

Visual Inspection

Packing / Shipping

Blind Vias, Buried Vias, Stack Vias Process

Conformal Mask

AOI

Laser Drilling

Plasma Processing

Copper Filled Vias / microvias Filling

Multilayer Board Process

CAM

Art Work

Issue Material

Inner Layer

AOI-Inner

Lamination

Drilling

Plating

Outer Layer

AOI-Outer

Solder Mask

Exposure/Silk screen

Surface Treatment

O/S Test

CNC

Visual Inspection

Packing / Shipping

Detailed Description

ShingTech adheres to the most rigorous attitude and produces the most precise PCB board products. Here to explain to you more detailed production content.
Guaranteed peace of mind.

File Formats

Category	Description	Manufacturing Capability	Remark
File Formats	Gerber Files- Preferred Format	274-X, 274-D, DPF, ODB++	-
File Formats	Drilling Files	X & Y coordinates, with tool sizes included	-

Layers Count

Category	Description	Manufacturing Capability	Remark
Layers Count	-	1L ~ 40L	-

Material

Category	Description	Manufacturing Capability	Remark
Material	Regular TG	NANYA NP140	-
	HIGH TG	NANYA NP175 ITEQ IT180TC, IT180A	-
	High Speed	ISOLA 370HR, FR408HR, I-Speed PANASONIC M6, M7	-
	Polyimide	ARLON 85N	-
	RF & Microwaves	ROGERS 4350B, 4003C, 4450F ROGERS 4835	-
	Aluminum Substrate	VENTEC 4A2H - 2.2W/mK, MOT 105℃ ARLON 92ML - 2.0W/mK, MOT 90℃	-
	Halogen Free	NANYA NPG series (151, 170D, 186)	-

Board Thickness

Category	Description	Manufacturing Capability	Remark
Board Thickness	Single / Double Sided (Min. - Max.)	0.2mm-8.0mm	-
Board Thickness	Multilayer(Min. - Max.)	0.3mm-8.0mm	-

Dimension

Category	Description	Manufacturing Capability	Remark
Dimension	Finish Board Size (Max.)	700mm x 550 mm	-
Dimension	Finish Board Size (Min.)	10 mm x 10 mm	TBD by actual design

Inner Layers

Category	Description	Manufacturing Capability	Remark
Inner Layers	Min. Gap from Trace to Drill	3.5mil	Remark (A)
	Pad Ring (Min.)	4mil	Remark (D)
	Min. Trace / Space	2mil / 2mil	-
	Min. Core Thickness	0.08mm	-
	Min. Pre-preg Thickness	0.05mm	-

Drilling

Category	Description	Manufacturing Capability	Remark
Drilling	Min. Drill Size	0.1mm	Remark (B)
	Diameter Tolerance	NPTH: +/- 2mil PTH: +/- 3mil	-
	Safety Pitch	0.25mm	Remark (C)
	Offset (True Position)	+/- 2mil	Remark (A)
	Laser Drilling	0.1mm	-

Plating

Category	Description	Manufacturing Capability	Remark
Plating	Aspect Ratio	30	(Max. 40)
Plating	Cu Thickness in Through Hole	2.4mil / 2oz	-

SMD PAD

Category	Description	Manufacturing Capability	Remark
SMD PAD	Pad Offset(True Position)	±25um	Remark (A)&Remark (B)
	Pad Size (Min.)	100um	Remark (C)
	Pad Size Tolerance	±30um	Remark (A)
	Pad Pitch	200um	Remark (A)
	Pad Spacing	100um	Remark (B)

Lamination

Category	Description	Manufacturing Capability	Remark
Lamination	Layer-to-layer Registration	3mil	-
Lamination	Layer-to-layer Pre-preg Tolerance	+/- 10%	-

Etching

Category	Description	Manufacturing Capability	Remark
Etching	Line Tolerance	+/- 20% or +/- 1mil	-
Etching	Min. Trace / Space	2.5mil / 2.5mil	-

Surface Finish

Category	Description	Manufacturing Capability	Remark
Surface Finish	HASL & HASL LF	17.5μm ~ 30μm	-
	Immersion Gold	1μ" ~ 8μ"	-
	Hard Gold / Soft Gold Plating	3μ" ~ 60μ"	(Max. 80μ")
	Immersion Tin	20u" ~ 30u"	-
	Immersion Silver	6u" ~ 8u"	-
	Entek (OSP)	-	-
	ENEPIG (Ni/Pd/Au)	Au: 2-4μ", Pd 4μ", Ni: 200μ"	-

Solder Mask

Category	Description	Manufacturing Capability	Remark
Solder Mask	S/M Thickness	0.4 mil ~ 2mil	-
	S/M Registration Tolerance	2mil	-
	S/M Size Tolerance	2mil	-
	Max. Plugged Vias Size	0.5mm or less	-
	Available Colors	Green, Light Green, Matte Green, White, High Reflective White, Black, Matte Black, Coffee Black, Yellow, Red, Matte Red, Blue, Matte Blue, Transparent, Purple, Orange, TEAL(Tiffany Blue), TAN(Brown)	-

Silkscreen

Category	Description	Manufacturing Capability	Remark
Silkscreen	Available Colors	White, Black, Yellow, Red, Blue, Green	-
	Max. Width	28mil	-
	Min. Safety Pitch (Width/Space)	3mil	-

Electrical Test

Category	Description	Manufacturing Capability	Remark
Electrical Test	Standards Testing	AOI & Flying Probe Test & Report	-
	Control Impedance Test	YES	-
	High Potential Test (HP-1000V)	YES	-

Copper Weight

Category	Description	Manufacturing Capability	Remark
Copper Weight	Inner Layer	1/3 oz ~ 6 oz	-
Copper Weight	Outer Layer	0.7oz ~ 12oz	-

Bow and Twist

Category	Description	Manufacturing Capability	Remark
Bow and Twist	-	3~7/1000	-

Controlled Impedance

Category	Description	Manufacturing Capability	Remark
Controlled Impedance	Single Ended	+/-5~10%	-
	Differential	+/-5~10%	-
	Coplanar	+/-5~10%	-

Routing / Cutting

Category	Description	Manufacturing Capability	Remark
Routing / Cutting	V-Cut / Score Web (Board Thickness >= 1.0mm )	0.2mm +/- 0.1mm (0.004")	-
	V-Cut / X&Y Position Tolerance	+/- 0.1mm (0.004")	-
	Rout Tolerance	+/- 0.15mm (0.006")	-
	CNC Tolerance	+/- 0.15mm (0.006")	-
	Bevelling, Chamfering Z-axis Routing, Back Drilling Counterbore, Countersink	Yes	-

Space BTW CUT-OUT

Category	Description	Manufacturing Capability	Remark
Space BTW CUT-OUT	Via	8mil	Remark (A)
	Trace	8mil	Remark (C)
	Pad	8mil	Remark (B)

BGA PAD

Category	Description	Manufacturing Capability	Remark
BGA PAD	Ball Pitch	12mil	-
BGA PAD	Ball spacing	4mil	-

Special Process

Category	Description	Manufacturing Capability	Remark
Special Process	Anylayers HDI	Blind Vias, Buried Vias, Stacked Vias(6+N+6)	-
	Via Tenting, Plugging, and Filling	Solder Mask, Non-conductive Epoxy, Microvia Filling, Conductive Copper Pastes	-
	Peelable Solder Mask / Carbon Ink	Yes	-
	Gold Finger	Gold-plated Connectors w/wo Wires	-
	Sideplating	Edge Plating, Castellation, Cavity Down	-

Hybrid Material Lamination

Category	Description	Manufacturing Capability	Remark
Hybrid Material Lamination	-	FR4+Rogers, Isola+FR4, Isola+Rogers	-

Certs

Category	Description	Manufacturing Capability	Remark
Certs	UL	UL and CSA marks	-
	ISO	ISO 9001 / ISO 14001	-
	Others	RoHS 3.0 / REACH 211	-